Realme Neo 7 SE, Redmi Turbo 4 among first phones to be powered by MediaTek Dimensity 8400

Realme Neo 7 SE, Redmi Turbo 4 among first phones to be powered by MediaTek Dimensity 8400 | Tech Tips



Highlights
  • Realme has teased a phone with the new MediaTek Dimensity 8400 SoC.
  • Redmi posted that the upcoming Turbo 4 will pack the Dimensity 8400 chipset.
  • The MediaTek Dimensity 8400 is based on TSMC’s second-gen 4nm process

The MediaTek Dimensity 8400 chipset, touted to be a mid-range chipset, has been announced officially, and phone brands such as Realme and Redmi are working on launching their first phones with the same chipset.

While Realme teased a phone with the chipset, Redmi confirmed that the Redmi Turbo 4 will be the first to feature the Dimensity 8400 chipset. Here’s more about the upcoming phones and the Dimensity 8400 chipset.


Realme phone teased to launch with Dimensity 8400

  • Without naming the smartphone, Realme on Weibo has teased a phone with a design schematic featuring the newly announced MediaTek Dimensity 8400 chipset.
  • While Realme hasn’t shared the phone’s name, tipster Digital Chat Station suggests that the Realme Neo 7 SE might be the first phone to pack this MediaTek chipset.
  • Notably, the Realme Neo 7 SE is expected to launch this year in China after the recent announcement of the Realme Neo 7, which arrived with the Dimensity 9300+ SoC.

Redmi Turbo 4 chipset, launch timeline confirmed

  • On the other hand, Redmi has revealed via the micro-blogging site that the upcoming Redmi Turbo 4 will be the first phone to pack the Dimensity 8400 chipset.
  • However, it mentions Dimensity 8400 Ultra, where the “Ultra” label could mean an overclocked version of the chipset.
  • The teaser also mentions that the Redmi Turbo 4 will be announced in January 2025. However, its reservation has begun in the home country.
  • Though not confirmed, the yet-to-be-launched Redmi Turbo 4 will reportedly be rebranded as POCO X7 Pro for global markets.

MediaTek Dimensity 8400 features

  • The all-new MediaTek Dimensity 8400, which has come as the successor to the Dimensity 8300, is based on TSMC’s second-gen 4nm process.
  • According to the company, the chipset supports WQHD+ resolution at up to 144Hz and dual-screen functionality and can handle cameras up to 320MP.
  • The MediaTek Dimensity 8400 SoC features eight ARM Cortex-A725 cores, with one core clocked at 3.25GHz, three at 3.0GHz, and four at 2.1GHz.
  • This chipset has the brand’s NPU 880, which is optimised to support mainstream LLM/LMM models for Gen-AI apps.
  • It also offers AI-powered features such as rewriting, contextual replies, media generation, AI recording, and translation.
Also Read

Redmi Turbo 4 specifications leak out ahead of rumoured January launch

Redmi Turbo 4 specifications leak out ahead of rumoured January launch


MediaTek Dimensity 8400 with all big CPU cores announced for mid-range phones

MediaTek Dimensity 8400 with all big CPU cores announced for mid-range phones

POCO X7 Pro tipped to be a Redmi Turbo 4 rebrand, POCO F7 could be Redmi Turbo 4 Pro


POCO X7 Pro tipped to be a Redmi Turbo 4 rebrand, POCO F7 could be Redmi Turbo 4 Pro


The post Realme Neo 7 SE, Redmi Turbo 4 among first phones to be powered by MediaTek Dimensity 8400 first appeared on 91mobiles.com.

Similar Posts