MediaTek Dimensity 8400 with all big CPU cores announced for mid-range phones | Tech Tips
As expected, MediaTek announced the new Dimensity 8400 processor today at an event held in China. This comes after the Taiwanese chipmaker unveiled the Dimensity 9400 SoC in October which powers flagship phones in China and globally. The newly launched Dimensity 8400 is a mid-range chipset and the successor to the last year’s Dimensity 8300. It is touted to have ‘all big core’ design similar to the premium Dimensity 9400. This means that it ditches the smaller energy efficiency cores. Read on to know all the details below.
MediaTek Dimensity 8400 specifications
- CPU structure: The Dimensity 8400 SoC has eight ARM Cortex-A725 cores. One of them is clocked at 3.25GHz, three at 3.0GHz, and other four cores ticking at 2.1GHz. MediaTek says that this delivers 41 percent higher multi-core performance and 44 percent reduced power compared to the Dimensity 8300.
- Graphics: The chipset packs a 1.3GHz ARM Mali-G720 MC6 GPU which is upgraded from Mali-G615 MC6 from its predecessor. The GPU works with MediaTek’s Frame Rate Converter and Adaptive Gaming Technology for a smoother and optimised gameplay.
- AI: This processor has MediaTek’s NPU 880 that is said to support mainstream LLM/LMM models for the latest Gen-AI applications. It will pack AI-powered features like rewriting, contextual replies, media generation, AI recording, and translation. The SoC also comes with the company’s DAE that debuted on the flagship Dimensity 9400. It will enable developers to create agentic AI apps.
- Camera support: The Dimensity 8400 supports up to 320MP camera. It comes with Imagiq 1080 ISP for producing high-resolution images. The chip supports HDR recording through the entire zoom range.
- Display: Phones powered by the Dimensity 8400 can support WQHD+ resolution up to 144Hz and dual screen support.
- Connectivity: The processor comes with 5G-Advanced modem with peak downlink speeds of 5.17Gbps.
Dimensity 8400 availability and confirmed phones
MediaTek stated that the first smartphones powered by Dimensity 8400 will be available in the market by the end of 2024. Xiaomi confirmed that the Redmi Turbo 4 will be the first phone to come with the chipset in early 2025. Realme also confirmed the use of Dimensity 8400 on its upcoming smartphone.
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